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| LESHAN RADIO COMPANY, LTD. Schmitt-Trigger Inverter L74VHC1G14 The L74VHC1G14 is a single gate CMOS Schmitt-trigger inverter fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The L74VHC1G14 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the L74VHC1G14 to be used to interface 5 V circuits to 3 V circuits. The L74VHC1G14 can be used to enhance noise immunity or to square up slowly changing waveforms. * High Speed: t PD = 4.0 ns (Typ) at V CC = 5 V * Low Power Dissipation: I CC = 2 mA (Max) at T A = 25C * Power Down Protection Provided on Inputs * Balanced Propagation Delays * Pin and Function Compatible with Other Standard Logic Families * Chip Complexity: FETs = 101; Equivalent Gates = 25 MARKING DIAGRAMS 5 4 1 2 3 VAd SC-70/SC-88A/SOT-353 DF SUFFIX Pin 1 d = Date Code 5 4 Figure 1. Pinout (Top View) 1 2 3 VAd Figure 2. Logic Symbol Pin 1 d = Date Code SOT-23/TSOP-5/SC-59 DT SUFFIX FUNCTION TABLE PIN ASSIGNMENT 1 2 3 4 5 NC IN A GND OUT Y V CC Inputs A L H Output Y H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. www..com 1/6 LESHAN RADIO COMPANY, LTD. L74VHC1G14 MAXIMUM RATINGS Value Unit - 0.5 to + 7.0 V - 0.5 to +7.0 V V CC=0 - 0.5 to +7.0 V High or Low State -0.5 to V cc + 0.5 I IK Input Diode Current -20 mA I OK Output Diode Current V OUT < GND; V OUT > V CC +20 mA I OUT DC Output Current, per Pin + 25 mA I CC DC Supply Current, V CC and GND +50 mA PD Power dissipation in still air SC-88A, TSOP-5 200 mW JA Thermal resistance SC-88A, TSOP-5 333 C/W TL Lead Temperature, 1 mm from Case for 10 s 260 C TJ Junction Temperature Under Bias + 150 C T stg Storage temperature -65 to +150 C V ESD ESD Withstand Voltage Human Body Model (Note 2) >2000 V Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A I LATCH-UP Latch-Up Performance Above V CC and Below GND at 125C (Note 5) 500 mA 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22-A114-A 3. Tested to EIA/JESD22-A115-A 4. Tested to JESD22-C101-A 5. Tested to EIA/JESD78 DC Supply Voltage DC Input Voltage DC Output Voltage RECOMMENDED OPERATING CONDITIONS Symbol Parameter V CC DC Supply Voltage V IN DC Input Voltage V OUT DC Output Voltage TA Operating Temperature Range Symbol V CC V IN V OUT Parameter Min 2.0 0.0 0.0 - 55 Max 5.5 5.5 V CC + 125 Unit V V V C TIME TO 0.1% BOND FAILURES Junction Temperature C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature 2/6 LESHAN RADIO COMPANY, LTD. L74VHC1G14 DC ELECTRICAL CHARACTERISTICS Symbol V T+ Parameter Positive Threshold Voltage Negative Threshold Voltage VH Hysteresis Voltage Test Conditions T A = 25C T A < 85C -55C V T- 1.35 2.3 1.65 2.9 0.30 0.57 0.40 0.67 0.50 0.74 1.9 2.9 4.4 2.58 3.94 2.0 3.0 4.5 1.20 1.40 1.60 V I IN I CC Maximum Input Leakage Current Maximum Quiescent Supply Current 4.5 I OL = 4 mA 3.0 4.5 I OL = 8 mA V IN = 5.5 V or GND 0 to5.5 V IN = V CC or GND 5.5 A A AC ELECTRICAL CHARACTERISTICS C load = 50 pF, Input t r = t f = 3.0 ns T A = 25C Symbol Parameter t PLH , Maximum t PHL Propagation Delay, Input A to Y Test Conditions V CC = 3.3 0.3 V C L = 15 pF C L = 50 pF V CC = 5.0 0.5 V C L = 15 pF C L = 50 pF C IN Maximum Input Capacitance Power Dissipation Capacitance (Note 6) Min Typ 7.0 8.5 4.0 5.5 5 Max 12.8 16.3 8.6 10.6 10 T A < 85C -55C Max Unit 17.0 ns 20.5 11.5 13.5 10 pF 1.0 1.0 1.0 C PD Typical @ 25C, V 7.0 = 5.0 V pF 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD * V CC * f in + I CC . C PD is used to determine the no- load dynamic power consumption; P D = C PD * V CC 2 * f in + I CC * V CC . 3/6 LESHAN RADIO COMPANY, LTD. L74VHC1G14 Figure 4. Switching Waveforms *Includes all probe and jig capacitance Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Temp Order Number Circuit Device Range Technology Indicator Function Identifier L74VHC1G02DFT1 L74VHC1G02DFT2 L74VHC1G02DTT1 L L L 74 74 74 VHC1G VHC1G VHC1G 14 14 14 Package Suffix DF DF DT Tape & Reel Suffix T1 T2 T1 Package Type (Name/SOT#/ Common Name) Tape and Reel Size SC-70/SC-88A/ SOT-353 SC-70/SC-88A/ SOT-353 SOT-23/TSOPS/ SC-59 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 4/6 LESHAN RADIO COMPANY, LTD. L74VHC1G14 PACKAGE DIMENSIONS SC70-5/SC-88A/SOT-353 DF SUFFIX G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 A 5 4 S 1 2 3 -B- D 5 PL 0.2 (0.008) M B M N J C DIM A B C D G H J K N S H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches 5/6 LESHAN RADIO COMPANY, LTD. L74VHC1G14 PACKAGE DIMENSIONS SOT23-5/TSOP-5/SC59-5 DT SUFFIX NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 D 5 1 2 4 3 S B L G A J C 0.05 (0.002) H K M DIM A B C D G H J K L M S SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches 6/6 |
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